View Z4K121-RL-10_4576861.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

FERRITE CHIP BEADS
1. PART NO. EXPRESSION :
Z4 SERIES
Z4K300-RN-10
(a)(b)(c) (d) (e) (f) (g)
(a) Series code (b) Dimension code (c) Material code (d) Impedance code : 300 = 30
(e) R : Reel (f) Current code : N = 3000mA (g) 10 : Lead Free
2. CONFIGURATION & DIMENSIONS :
A D L G
B
C
PCB Pattern Unit:m/m
A
B
C
D
G 2.20 Ref.
H 1.40 Ref.
L 4.40 Ref.
3.200.20 1.600.20 1.100.20 0.500.30
3. SCHEMATIC :
4. MATERIALS : b a
Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.)
(a) Body : Ferrite (b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION : a) Temp. rise : 30C Max. b) Rated current : Base on temp. rise c) Storage temp. : -55C to +125C d) Operating temp. : -55C to +125C e) Resistance to solder heat : 260C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP BEADS
6. ELECTRICAL CHARACTERISTICS : Part Number Z4K300-RN-10 Z4K500-RN-10 Z4K800-RN-10 Z4K121-RL-10 Z4K151-RL-10 Z4K301-RJ-10 Z4K471-RJ-10 Z4K501-RN-10 Z4K601-RL-10 EIA Size 1206 1206 1206 1206 1206 1206 1206 1206 1206 Impedance () 30 25% 50 25% 80 25% 120 25% 150 25% 300 25% 470 25% 500 25% 600 25% Test Frequency ( MHz ) 100 100 100 100 100 100 100 100 100 DC Resistance () Max. 0.04 0.04 0.04 0.10 0.10 0.20 0.20 0.04 0.10
Z4 SERIES
Rated Current ( mA ) Max. 3000 3000 3000 2000 2000 1000 1000 3000 2000
7. IMPEDANCE VS. FREQUENCY CURVES :
Z4K300-R 30 H B3216K-3 N-00 0 C Z4K300-RN-1 00T
120
150
Z4K500-R 30 H Z4K500-RN-1 C B3216K-5 N-00 00T 0
IM PED ANC hm E(O )
IM PED ANC hm E(O )
90
100
60
Z
50
Z
30
X
0 1 10
X R
0
R
100 1000
1
10
100
1000
F REQU CY EN (MH z)
F REQU CY EN (MH z)
Z4K800-R 30 H B3216K-8 N-00 0 C Z4K800-RN-1 00T
160
360
Z4K1 21T20 21 -RL-1 0 H Z4K121-R L-00 CB 3216K-1
300
IM PED ANC hm E(O )
Z
80
IM PED ANC hm E(O )
120
240 180
Z
X
40
120
60
X R
1 10 100 1000
R
0 1 10 100 1000
0
F REQU CY EN (MH z)
F EQ R UEN (M z) CY H
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP BEADS
7. IMPEDANCE VS. FREQUENCY CURVES :
Z4 SERIES
51 20 H Z4K151-R L-00 0 CB Z4K151T 3216K-1 -RL-1
300
-RJ-1 Z4K301-R J -00 H Z4K30101T 0 CB 3216K-3 10
400
Z
300
IM PED ANC hm E(O )
200
Z
IM PED ANC hm E(O )
200
100
X R
0 1 10 100 1000
100
X R
0 1 10 100 1000
F EQ R UEN (M z) CY H
F EQ R UEN (M z) CY H
Z4K471 10 -RJ-1 H Z4K471-R J -00 CB 3216K-4 71T 0
800
800
-RN-1 Z4K501-R N-00 H Z4K501 01T 0 CB 3216K-5 30
IM PED ANC hm E(O )
IM PED ANC hm E(O )
600
600
Z
400
Z
400
200
200
X
0 1 10
R
X
0
R
1000
1 10 100 1000
100
F EQ R UEN (M z) CY H
F EQ R UEN (M z) CY H
Z4K601 200 H Z4K601-R L-00 CB 3216K-6-RL-1 01T
800
Z IM PED ANC hm E(O )
600
400
200
0 1 10
R
X
100 1000
F EQ R UEN (M z) CY H
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP BEADS
8. RELIABILITY & TEST CONDITION :
Z4 SERIES
ITEM
Electrical Characteristics Test Impedance DC Resistance Rated Current Temperature Rise Test Solder Heat Resistance
PERFORMANCE
TEST CONDITION
HP4291A, HP4287A+16092A HP4338B 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2605C Flux for lead free : rosin Dip Time : 100.5sec.
Refer to standard electrical characteristics list
30C max. ( t) Appearance : No significant abnormality Impedance change : Within 30%
Preheating Dipping 260C 150C Natural cooling
60 seconds
100.5 seconds
Solderability
More than 90% of the terminal electrode should be covered with solder.
Preheating Dipping 245C 150C Natural cooling
Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2455C Flux for lead free : rosin Dip Time : 41sec.
60 seconds
41.0 seconds
Terminal Strength
The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
For Z Series : Size 1 2 3 4 5 6 Force (Kfg) 0.2 0.5 0.6 1.0 1.0 1.0 1.5 2.0 > 25 Time (sec)
W
W
7 8
Flexture Strength
The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
20(.787) Bending 45(1.772) 45(1.772) 40(1.575)
Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return.
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
FERRITE CHIP BEADS
8. RELIABILITY & TEST CONDITION :
Z4 SERIES
ITEM
Bending Strength
PERFORMANCE
The ferrite should not be damaged by forces applied on the right condition.
R0.5(0.02) 1.0(0.039)
TEST CONDITION
Series name Z2 Z3 Z4 Z5 Z6 Z7 Z8 mm (inches) 0.80 (0.033) 1.40 (0.055) 2.00 (0.079) 2.70 (0.106) P-Kgf 0.3 1.0 2.5 2.5
Chip A
Random Vibration Test
Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed. Impedance : Within 30% Drop 10 times on a concrete floor from a height of 75cm. Appearance : No damage. Impedance : Within 30% of initial value.
Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). a. No mechanical damage b. Impedance change : 30% Temperature : 1255C Applied Current : rated current Duration : 100812hrs Measured at room temperature after placing for 2 to 3hrs. Humidity : 90~95% RH. Temperature : 402C Duration : 100812hrs Measured at room temperature after placing for 2 to 3hrs.
Drop Loading at High Temperature
Humidity
Thermal Shock
Appearance : No damage. Impedance : Within 30% of initial value. Phase 1 2 Temperature (C) -552C +1255C Times (min.) 303 303
For Z Series : Condition for 1 cycle Step1 : -552C 303 min. Step2 : +1255C 303 min. Number of cycles : 5 Measured at room temperature after placing for 2 to 3hrs. Temperature : -552C Duration : 100812hrs Measured at room temperature after placing for 2 to 3hrs.
Measured : 5 times Low temperature storage test
Drop
Drop 10 times on a concrete floor from a height of 75cm.
a. No mechanical damage b. Impedance change : 30%
Derating
6 6A 5A 4A 3A 2A 1.5A 1A
Derating Curve
Derated Current(A)
For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve.
5 4 3 2 1 0
85
125
Operating Tem perature(C) Operating Temperature(X ) C
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
FERRITE CHIP BEADS
9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern
4.40 2.20
Z4 SERIES
9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave, typical at 230C. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 2 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350C tip temperature (max) f) Limit soldering time to 3 secs. c) Never contact the ceramic with the iron tip
Preheating Soldering
20~40s TP(260C/10s max.) 217 200 150 60~180s 25 480s max. 60~150s
TEMPERATURE C
TEMPERATURE C
Natural cooling
1.40
PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure.
Preheating
260 245 150
Soldering
Natural cooling
Time(sec.) Figure 1. Re-flow Soldering
Over 2min.
Gradual Cooling Within 10s
Preheating
Soldering
3s (max.) 10s (max.)
TEMPERATURE C
Natural cooling
Figure 2. Wave Soldering
350 330 150
Over 1min.
Gradual Cooling
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
FERRITE CHIP BEADS
Z4 SERIES
9-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit Recommendable
t
Figure 4
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
FERRITE CHIP BEADS
10. PACKAGING INFORMATION : 10-1. Reel Dimension
A
Z4 SERIES
Type 7" x 8mm
D B C
A(mm) 9.00.5
B(mm) 60.02.0 60.02.0
C(mm)
D(mm)
13.50.5 178.02.0 13.50.5 178.02.0
7" x 12mm 13.50.5
20.5
13.50.5 R10.5
7" x 8mm
7" x 12mm
R1.9
R0.5
120
10-2 Tape Dimension / 8mm Material : Paper
P2:20.1 E:1.750.1 Po:40.1 D:1.56 +0.1 -0.05 t
Series
Size 1
Bo(mm) 1.120.03 1.850.05 2.300.05
Ao(mm) 0.620.03 1.050.05 1.500.05
Ko(mm) 0.600.03 0.950.05 0.950.05
P(mm) 2.00.1 4.00.1 4.00.1
t(mm) 0.600.03 0.950.05 0.950.05
D1(mm) none none none
F:3.50.1
W:8.00.1
Bo
Z/L
2 3(09)
P
Ao
Ko
Material : Plastic
P2:20.05 E:1.750.1 Po:40.1 D:1.5+0.1 A W:8.00.1 t
Series
Size 2 3(09)
Bo(mm) 1.950.10 2.250.10 2.350.10 3.500.10 3.420.10
Ao(mm) 1.050.10 1.420.10 1.500.10 1.880.10 2.770.10
Ko(mm) 1.050.10 1.040.10 1.450.10 1.270.10 1.550.10
P(mm) 4.00.1 4.00.1 4.00.1 4.00.1 4.00.1
t(mm) 0.230.05 0.220.05 0.220.05 0.220.05 0.220.05
D1(mm) none 1.00.1 1.00.1 1.00.1 1.00.1
F:3.50.05
Bo
Z/L
3(12) 4 5
P
A D1:10.1
Ao
Ko
Section A-A
10-2.1 Tape Dimension / 12mm
D:1.5+0.1 E:1.750.1 A W:12.00.1 Po:40.1 P2:20.05 t
Series
Size 6
Bo(mm) 4.950.1 4.950.1 6.100.1
Ao(mm) 1.930.1 3.660.1 5.400.1
Ko(mm) 1.930.1 1.850.1 2.000.1
P(mm) 4.00.1 8.00.1 8.00.1
t(mm) 0.240.05 0.240.05 0.300.05
D1(mm) 1.50.1 1.50.1 1.50.1
F:5.50.05
Bo
Z/L
7 8
A D1:1.50.1
P
Ao
Ko
Section A-A
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
FERRITE CHIP BEADS
Z4 SERIES
10-3. Packaging Quantity Chip Size Chip / Reel Inner Box Middle Box Carton Bulk (Bags) 8 1000 4000 20000 40000 7000 7 1000 4000 20000 40000 12000 6 2000 8000 40000 80000 20000 5 2500 12500 62500 125000 30000 4 3000 15000 75000 150000 50000 3 (12) 2000 10000 50000 100000 100000 3 (09) 4000 20000 100000 200000 150000 2 4000 20000 100000 200000 200000 1 10000 50000 250000 500000 300000
10-4. Tearing Off Force F 165 to 180 Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions.
Room Temp. (C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300
Base tape
Application Notice
1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10 ~ 40C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9

▲Up To Search▲

Price & Availability of Z4K121-RL-10

	To Download Z4K121-RL-10 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .